Electronics Manufacturing X-ray Inspection System
Inline and offline X-ray inspection for SMT, PCB, and BGA assemblies, identifying solder voids, bridging, and component placement defects.
Ailante serves electronics, new energy, and semiconductor manufacturers requiring in-line and offline NDT inspection, built and supported in Shenzhen.
Inline and offline X-ray inspection for SMT, PCB, and BGA assemblies, identifying solder voids, bridging, and component placement defects.
Non-destructive X-ray detection of internal porosity, cracks, and inclusions in cast metal components for automotive and industrial applications.
X-ray inspection of lithium cell internal structure, electrode alignment, and winding quality to support battery manufacturing quality control.
X-ray-based SMD reel and tray component counting system that measures quantity without opening packaging, reducing counting errors and handling time.
Acoustic microscopy system for non-destructive detection of delamination, voids, and cracks in semiconductor packages, substrates, and bonded assemblies.
Ailante designs and manufactures all inspection systems at its Shenzhen facility, giving buyers a direct line to engineering for application-specific configuration and after-sales technical support.
A single supplier address SMT/PCB, industrial casting, lithium battery, and semiconductor inspection requirements, reducing qualification overhead for multi-site manufacturers.
Ailante combines X-ray transmission imaging (HS 9022.19 / 9022.90) with C-SAM ultrasonic scanning (HS 9031.49), providing complementary detection methods from one source.
Product lines are segmented by application, electronics, casting, battery, semiconductor, so buyers receive a system configured for their specific production environment rather than a generic platform.
Ailante Technology is a direct manufacturer based in Songgang, Shenzhen, Guangdong. Systems are designed and produced at the company's own facility.
Current product lines address four sectors: electronics manufacturing (SMT, PCB, BGA), industrial casting (automotive and general industry), lithium battery and new energy production, and semiconductor packaging inspection.
X-ray inspection equipment is classified under HS 9022.19 and 9022.90. Optical and ultrasonic detection instruments, including the C-SAM, fall under HS 9031.49. Confirm the applicable subheading with your customs broker for your specific import jurisdiction.
Yes. In addition to X-ray transmission systems, Ailante manufactures C-SAM (C-mode Scanning Acoustic Microscope) ultrasonic instruments for delamination and void detection in semiconductor and bonded-material applications.
Submit the inquiry form on this page with your application type, target material or assembly, and throughput requirements. An Ailante technical representative will respond with configuration options and pricing.