Thermal Interface, Potting, and Bonding Materials for EV and Electronics

Encapsulants and Potting Compounds

Two-part epoxy, polyurethane, and silicone potting systems with dielectric strength up to 20 kV/mm on listed grades.

• AP-9180 BH1 epoxy, 0.7 W/m·K, -40~180°C
• AP-9622 L11 clear polyurethane, ≥20 kV/mm
• 905 G21 electronic encapsulant, 0.7 W/m·K
• Two-part high thermal conductivity potting adhesive

Thermal Interface Materials

Thermal conductivity from 1.0 to 14.0 W/m·K across gels, gap fillers, pads, and grease.

• AP8120 TP1400 one-part thermal gel, 14.0 W/m·K
• AP8120 MG1000 two-part gap filler, 10.0 W/m·K
• Tc-Pad AP600 12002 gap pad, 12.0 W/m·K, 0.50-14.00 mm
• 5701 thermal grease, 7.0 W/m·K, -40~200°C

Structural Adhesives

Epoxy, polyurethane, acrylic, and UV-curing systems, with Al-Al shear strength up to 17 MPa on listed grades.

• AP-9110 GA12 two-part epoxy, 15 MPa Al-Al shear
• AP-9170 G50 one-part epoxy, Tg 150°C
• AP-9622 BG12 polyurethane, 17.0 MPa shear, 1.2 W/m·K
• AP-9770 AH1 acrylic, 4 min pot life

Foam Sealants and Encapsulants

Two-part silicone and polyurethane foams, with silicone foam sealants rated IP68.

• 907 G30 silicone foam sealant, 0.25-0.35 g/cm³, IP68
• 907 W30 silicone foam encapsulant, 40±10 Shore C
• AP-9622 P225 polyurethane foam, expansion 3~6

Silicone Adhesive Sealants

One-part and two-part RTV and heat-curing silicones for bonding, sealing, and flange applications.

• AP-608 G123 flange sealant, -55~260°C
• AP-607 W222 thermally conductive RTV, 6.5 W/m·K
• AP-753 L140 low VOC sealant, ≥44 kV/mm
• 907 B96 heat-curing adhesive, up to 280°C

Specialty Protection Materials

Conformal coatings, silane modified sealants, ceramifiable silicone tape, thermal runaway protection materials, and silicone immersion coolant.

• Conformal coatings
• Silane modified (MS) sealants
• Ceramifiable silicone tape
• Silicone immersion coolant

More products

• Two-part thermally conductive gap filler
• Two-part polyurethane encapsulant