4 million SMT placements per day, multilayer PCBs up to 60 layers, AOI-verified and built to your Gerber files in a controlled production environment.
High-volume SMT pick-and-place at 4 million points/day with BGA/QFP placement, paired with through-hole soldering at 300,000 points/day.
Rigid and high-frequency multilayer PCBs from 2 to 60 layers, supporting HDI blind/buried vias and micro vias across a range of substrate materials.
Component sourcing integrated into the assembly workflow, covering standard and specialist parts to support full turnkey PCBA projects.
Finished assemblies manufactured to customer designs across industrial control, IoT, audio, and utility metering applications.
All assembly lines operate in a controlled, dust-free environment with automated optical inspection (AOI) after placement to catch defects before they reach the next process stage.
Production capacity of 4 million SMT placement points and 300,000 through-hole soldering points per day supports both prototype runs and high-volume OEM orders without scheduling bottlenecks.
Toger manufactures multilayer PCBs up to 60 layers with HDI blind, buried, and micro via structures on FR4, Rogers, Polyimide, Arlon, Isola, and Nelco substrates.
Component procurement, SMT assembly, through-hole soldering, AOI inspection, and functional testing are handled within a single facility, reducing handoff risk and lead time.
Equipment and process controls support fine-pitch BGA and QFP placement, making Toger suitable for complex, high-density designs common in industrial and IoT applications.
Toger is a manufacturer. Shenzhen Toger Electronic Technology operates its own SMT lines, through-hole soldering equipment, and multilayer PCB production, with no outsourcing of core assembly processes declared.
Toger manufactures multilayer PCBs up to 60 layers, including HDI designs with blind vias, buried vias, and micro vias. Supported substrate materials include FR4, Polyimide, Rogers, Arlon, Isola, and Nelco.
SMT pick-and-place capacity is 4 million placement points per day. Through-hole soldering capacity is 300,000 points per day. These figures are supplier-declared; confirm current scheduling availability before placing orders.
Products from Toger are classified under HS 8534.00 (printed circuits) and HS 8537.10 (boards, panels, and consoles for electric control). Confirm the applicable code with your customs broker for your specific import.
Yes. Toger offers electronic component procurement as part of its service offering, supporting turnkey PCBA projects where the customer supplies Gerber files and BOM. Confirm BOM coverage and lead time for specialist components at the quoting stage.
Use the pricing request form on this page. Provide your Gerber files, BOM, target quantity, and any relevant stackup or material requirements. The Toger team will respond with a project-specific quote.